Electronic Materials and Processes Handbook by Charles Harper

By Charles Harper

Digital fabrics are the particular semiconductors, plastics, metals and ceramics that make up the chips and programs from which we build today?s mobile phones, palmtops, and PDAs. The swap in functions from computers to smaller communications units has pushed the micro-miniaturization development in electronics, which in flip has created a brand new set of demanding situations in growing fabrics to fulfill their requirements. . . This new version, the 1st replace of the guide considering the fact that 1993, is an entire rewrite, reflecting the nice value of engineering fabrics for thermal administration and suppleness and micro-miniature sizes. This new instruction manual could be a useful device to somebody operating digital packaging, fabrication, or meeting design.. . (20031101)

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Cloths are impregnated for laminating, and tightly wound coils are impregnated in liquid resin using air pressure or vacuum as the impregnating force. Inhibitor A chemical added to resin to slow down the curing reaction. Inhibitors are normally added to prolong the storage life of thermosetting resins. Insulation resistance The ratio of applied voltage to total current between two electrodes in contact with a specific insulator. Modulus of elasticity The ratio of stress to strain in a material that is elastically deformed.

7. Using phosphorus as the dopant, an n-type region in the p-type silicon base is created by diffusion (Sec. 3). com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. 42 Typical process sequence in the fabrication of a silicon planar bipolar transistor. com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. 46 Chapter 1 8. A new layer of silicon dioxide is grown on the surface of the n-region, and steps (2) through (6) are repeated to create a new window in the SiO2.

Com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. 1 Definition of Terms for Plastic Materials (Continued) Heat sealing A method of joining plastic films by simultaneous application of heat and pressure to areas in contact. Heat may be supplied conductively or dielectrically. Hot-melt adhesive A thermoplastic adhesive compound, usually solid at room temperature, that is heated to a fluid state for application. Hydrocarbon An organic compound having hydrogen atoms in its chemical structure.

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