Advanced Microwave Circuits and Systems by V. Zhurbenko

By V. Zhurbenko

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A study of multielement transmission lines, IRE Transactions on Microwave Theory and Techniques, vol. 8, no. 2, pp. 136–142. Kolding, T. E. (1999). 105–110. Kolding, T. E. (2000a). Impact of test-fixture forward coupling on on-wafer silicon device measurements, IEEE Microwave Guided Wave Letters, vol. 10, no. 2, pp. 73–74. Kolding, T. E. (2000b). A four-step method for de-embedding gigahertz on-wafer CMOS measurements, IEEE Transactions on Electron Devices, vol. 47, no. 4, pp. 734–740. Koolen, M.

A thru-only de-embedding method for on-wafer characterization of multiport networks (a) G 1 S G 3 S G 23 (b) G S 2 300µm G S 4 G Fig. 9. (a) Micrograph of a THRU with GSGSG pads. (b) A pair of 1 mm-long TLs with the same pads. 6 µm. Nominal differential characteristic impedance is 100 Ω. 18-µm CMOS process. 5. De-embedding of 4-port with even/odd symmetry Suppose a 4-port under measurement can be represented as a cascade of three four-ports, as shown in Fig. 8(a). Then, its transfer matrix can be written as Tmeas = TL Tdut TR .

7, pp. 1530–1539. Daniel, E. , Harff, N. , Schreiber, S. , and Gilbert, B. K. (2004). Network analyzer measurement de-embedding utilizing a distributed transmission matrix bisection of a single THRU structure, 63rd ARFTG Conference, pp. 61–68. Faria, J. A. B. (2004). A new generalized modal analysis theory for nonuniform multiconductor transmission lines, IEEE Transactions on Power Systems, vol. 19, no. 2, pp. 926–933. , Natsukari, Y. , and Fujishima, M. (2008). New on-chip de-embedding for accurate evaluation of symmetric devices, Japanese Journal of Applied Physics, vol.

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